The Performance of Corn Husk Particleboard as Insulation Material: The Effect of Varied Particleboard Densities

Kurnia Wiji Prasetiyo; . Ismadi; Bambang Subiyanto; Dian Anggraini Indrawan; Lilik Astari; Ignasia Maria Sulastiningsih; Firda Aulya Syamani

doi:10.48084/etasr.11512

Authors

Kurnia Wiji Prasetiyo Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia
Ismadi Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia
Bambang Subiyanto Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia
Dian Anggraini Indrawan Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia
Lilik Astari Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia
Ignasia Maria Sulastiningsih Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia
Firda Aulya Syamani Research Center for Biomass and Bioproducts, National Research and Innovation Agency, Indonesia

Volume: 15 | Issue: 4 | Pages: 25055-25060 | August 2025 | https://doi.org/10.48084/etasr.11512

Received: 15 April 2025 | Revised: 20 May 2025 | Accepted: 25 May 2025 | Online: 2 August 2025

Corresponding author: Kurnia Wiji Prasetiyo

Abstract

Insulation materials are important in the construction field. They are produced from organic and inorganic sources, while they are non-renewable and not very friendly towards the environment. Given the environmental pollution concerns related to the construction sector, researchers are trying to use alternative materials for insulation purposes to save energy and reduce the environmental pollution. The present research investigates the performance of particleboard made of corn husk bonded with Water-Soluble Chitosan (WSC) as an insulation material. The most important insulation characteristics of the corn husk particleboard were examined for 3 different densities (0.6, 0.8 and 1.0 g/cm³). The results showed that WSC is a suitable natural adhesive for particleboards, which are meant to be used as insulation materials, while their performance is determined by the targeted density.

Keywords:

corn husk, insulation materials, particleboard, performance, target density

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