Presenting the Secure Collapsible Makerspace with Biometric Authentication


  • Muhammad Syafiq Abdul Razak Department of Electrical, Electronic and Systems Engineering, Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Malaysia
  • Sundaraja Perumal A. Gothandapani Ignitive Minds PLT, Malaysia
  • Noorfazila Kamal Department of Electrical, Electronic and Systems Engineering, Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Malaysia
  • Kalaivani Chellappan Department of Electrical, Electronic and Systems Engineering, Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Malaysia
Volume: 14 | Issue: 1 | Pages: 12880-12886 | February 2024 |


Traditional product design learning is inefficient, costly, and limited by safety concerns in physical and smaller-scale school workshops. The Secure Collapsible Makerspace is a mobile makerspace with smart sensors and an expandable work area facility. This study aims to develop a smart mobile makerspace platform using edge computing architecture and the biometric security model to compare real-time learners’ engagement time and design performance. The developed platform consists of four blocks that provide service as a makerspace for the learners and monitor their utilization in a secure environment. The edge computing architecture allows real-time analysis of the users’ makerspace utilization. A total of 750 learners were accessed for their product design outcome which presented a positive correlation of 0.72 between the engagement time and the design assessment with a corresponding p-value less than 0.001. This study concludes that makerspaces can be a platform that improves students’ performance in hands-on activity-related learning.


active learning, biometrics, Internet of Things, intrusion detection, remote monitoring


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How to Cite

M. S. Abdul Razak, S. P. A. Gothandapani, N. Kamal, and K. Chellappan, “Presenting the Secure Collapsible Makerspace with Biometric Authentication”, Eng. Technol. Appl. Sci. Res., vol. 14, no. 1, pp. 12880–12886, Feb. 2024.


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